COVERLAY

 

 

 

Profile Features

 Polyimide

Liquid/Epoxy

Liquid/ Polyimde

Flexibility

Good

Short life

Good

Heat Resistance

High

Low

High

Electrical Properties

Good

*

*

Registration Accuracy

 

High

Low

Very high

Technical Hurdle

High

High

Very High

Storage Condition

Room Temp.

Refrigerator

Freezer

Cost

High

Low

High

 * - Subject to manufacturer


Highlighted materials are the most common type and more economic.
A coverlay system should have solder dam capability and also strong circuit protection capability to withstand long flexing life. The selection of coverlay material must be accorded to performance requirements.
A balanced construction of identical dielectric material is ideal for positioning all the circuits pattern in a mechanically neutral zone.
Obviously, screen printed epoxy or liquid photoimagable covercoat is the least expensive method of circuit protection but is less robust than the bonded coverlay equivalent.

 

 

 

Customer reference/客户

 

 

 

Suiwa High Technology Electronic Industries (Xiamen) Co, Ltd.
Sales (English): 0086-592-5905531,5905788
Sales (Japanese): 0086-592-5905785,5905777
Phone: 0086-592-592 0000
Fax : 0086-592-5920123
Email: sales@swflex.com
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